RFID Inlay Manual Chip Bonding Machine
This is for RFID inlay sample making or small quantity of products making machine. This equipment is easy operation, has many features, stable process and high accuracy.
This machine is manual feeding, using cameras to check the positioning, applies conductive adhesive, and hot press to make the chips firmly bonding, and the bonding chips will move to the hot press station to make the press.
1. Apply 1 unit of vision system which has 2 PCS of cameras which could make positioning for the chips and antenna. The top camera position could be adjusted slightly, the cameras are easy to tune.
2. Apply 2 units of 12 inch display, which could make the image more clearly and easy to check.
3. The Hot Press Station is independent. Different hot pressure, temperature, time could be easily achieved and with high accuracy.
4. It could also work for chips size bigger than 2mm.
5. The chip’s pick and placer process could be watched through the display, and also could be seen the good or NG chips.
6. The glue dispenser is digital, the volume could be accurate controlled.
7. The antenna is fixed by vacuum during the glue dispensing progress, which could improve the accuracy and stability.
8. The machine is easy operation and maintenance.
9. It is every convenient for RFID label sample making, testing or small quantity of production.
0.5 to 0.7 MPa
50 to 200g
0.3mm×0.3mm to 2mm×2mm
50 to 250 ℃
Chip Placing Accuracy
PET, PVC, Paper
ACA, NCA, ICA
Phone: +86 0755-29885805
Add: D1, Building F, Tangwei Industrial Park, Guangming New Area, Shenzhen, China