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RFID Inlay Sample Bonding Machine

Due to the booming of RFID technology, to meet the needs of different RFID inlay sample, we launch the new bonding machine which is widely used in lab for RFID inlay sample making
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Product details

Model:LTD-WD2019A


Due to the booming of RFID technology, to meet the needs of different RFID inlay sample, we launch the new bonding machine which is widely used in lab for RFID inlay sample making


•   Range in testing device: The adaptive experiment of electrician, electric parts and related materials in high/low temperature saving, transportation and using 

•   Testing condition: Environment temperature is +25℃. Relative humidity ≤85%. No exist samples in testing chamber.

•   Testing way: GB/T 5170.2-1996 temperature testing device and GB/T 5170.5-1996 damp and hot testing device (Only damp/hot model)

•   Temperature range: -70℃→+150℃ (Temperature fluctuate in ±0.5℃ and distribution accuracy in ±2.0℃)

•   Humidity range: 20%~98%R.H (Humidity fluctuate in ±3%R.H and distribution accuracy in ±3.0%.) (Only damp/hot model)

•   Heating up time: -70℃→+150℃ and 4.0℃/min in heating up time

•   Heating down time: +150℃→ -70℃ and 1.0℃/min in heating down time

 


TECHNICAL PARAMETERS

•   Equipment size: Length in 640mm, width 460mm , height 620mm;
 
•   Weight and power: about 35kg and 200W;
 
•   Pressure setting: 60 to 200g can be accurately set error of0.05N;
 
•   Thermal pressure temperature: 50 to 250 degrees C, through the touch screen setting.
 
•   Chip: 0.3mm x 0.3mm to 2.5mm x 2.5mm, high frequency, UHF is suitable;
 
•   Chip loading: Tray loading, manual loading,8 inch wafer device optional;
 
•   Antenna loading: manual feeding, adapt to PET, PVC, PAPER and size of 120mmX100mm;
 
•   Video system: 2 visual positioning systems;
 
•   Control mode and power supply: PLC and touch screen, 220VAC;
 
•   Patch accuracy and glue adaptability: 25um, to adapt to the market all kinds of anisotropy conductive adhesive

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