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Chip Module Initialization & Pre-personalization Machine

Presentation: To make initialization and pre-personalization of contact chips. Advantage: High Speed, High precision and high stability. Application: SIM/GSM Card Manufacturer
Send Email:info@ldtkj.com

Product details

LDT-256T is an upgrade product designed for the increasing production requirement of chip encapsulation & testing factories and smart card manufacturers. The brand-new design enables operators to switch chips production between 6PIN and 8PIN within 60 seconds.
It integrates short-circuit punching, open and short test, chip initialization & pre-personalization as well as reject chip punching and marking. Modular design can meet your different production requirements and maximize decreasing your investment cost.
PTM-120B can be applied to contact/contactless and dual interface chip initialization, and also can be customized according to the demands for various chip production.

•  Unique Patented Technology

It only takes 60s to switch production tasks between 6PIN and 8PIN contact chip.

•  High-performance Reader
The top Chinese industrial-class reader developed with open/short test function is stable and high cost-effective.

•  120Heads Ensure High Throughput
Max. throughput 99,000UPH for 6PIN chip;
Max. throughput 71,000UPH for 8PIN chip.

•  Modular Design
Each module can work independently or be combined on demand.

•  Unrestricted Workplace
Free of production site due to electric driving design without external air supply.


•  Unwinding Module
It is convenient to adjust the position of driving tray and driven tray to meet the needs of different unwinding directions. It is compatible for the trays with 12.6MM and 38MM diameter of axle.

•  Initialization Module
It realizes fast switch between 6PIN and 8PIN chip production; 120 heads at most can be configured simultaneously; Contact/contactless and dual interface chip module initialization can be achieved; The module can be set up with a standalone style.

•  Re-Initialization Module
2 sets of contact heads or 3 sets of contactless heads are equipped for automatic re-initialization of failed chips, which can reduce the rejection rate.

•  Reject Chip Punching Module
Realizing reject chip punching and the punching positon is set up flexibly via software instead of manual adjustment, which greatly improve punching precision and production efficiency; The module can be set up with a standalone style.

•  Rewinding Module
Rewinding and packing the personalized tapes with guard band; The module can be set up with a standalone style.

•  Short-circuit Punching Module (Optional)
Realizing chips short-circuit disconnection; Module tapes with different specifications can be punched by quick replace of punching mould; The module can be set up with a standalone style.



Throughput of Contact Chip (120 Heads)


Including short-circuit punching module

Excluding short-circuit punching module


• 4750mm x 840mm x 1960mm

• 3800mm x 840mm x 1960mm


• 800kg

• 650kg

Power Supply

• 220V (-5% ~ +10%), 50Hz, 4KW

• 220V (-5% ~ +10%), 50Hz, 2KW

Maximum Throughput

• 60,000UPH

• 99,000UPH (6PIN)

Short-circuit Punching Throughput

• Max. throughput 60,000UPH(14 chips/punch)


• <50dB

Operation Temperature

• 23℃ ± 3℃

Operation Humidity

• 50 ± 10%

Chip Module Specification

• M2 and M3

Communication Interface

• Ethernet

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