Auto Patch Pick and Place Machine

Product Overview

The Auto Patch Pick and Place Machine is a high-precision, automated solution specifically engineered for the rapid and accurate placement of Chip-on-Board (COB) modules onto pre-milled smart card sheets. Designed for high-volume smart card, RFID, and electronics manufacturing, this machine streamlines the critical process of transferring COB chips from carrier tape to substrate with exceptional speed and reliability. By integrating automated punching, precision glue dispensing, and multi-head placement in one system, it significantly enhances production efficiency, reduces manual handling, and ensures consistent placement quality essential for next-generation contactless device performance.

Core Functionality & Process

The machine executes a fully automated, multi-stage workflow:

1. Automated Tape Handling & Punching: A roll of COB modules in tape-and-reel format is loaded onto the machine. The system automatically advances the tape and punches out individual chips with precision.

2. Multi-Head Pick and Place: The machine is equipped to pick up 6 chips simultaneously using a multi-head assembly, dramatically increasing throughput compared to single-head systems.

3. Dual-Platform, Non-Stop Operation: Features both A and B working platforms operating with a single-chip, 3-axis (AY, BY, X) work mode. This intelligent design allows one platform to be in the placement cycle while the other is in the preparation or unloading phase, enabling continuous operation and maximizing machine utilization.

4. Integrated Precision Glue Dispensing: Six independent glue dispensing units work in tandem with the pick-and-place heads. Crucially, the glue dispensing group and the pick-and-place group can operate simultaneously on different platforms, eliminating a major bottleneck and further boosting efficiency.

5. High-Accuracy Positioning: Driven by a high-performance servo system, the machine achieves a remarkable placement accuracy of ±0.05mm on the X and Y axes, ensuring each chip is positioned perfectly within its designated cavity on the PVC, ABS, or PETG sheet.

Key Features & Advantages

• High Throughput: Capable of placing approximately 8,000 chips per hour, making it ideal for mass production.

• Exceptional Precision: ±0.05mm placement accuracy guarantees the reliability and performance of the final smart card or electronic module.

• Dual-Platform Flexibility: The A/B platform design with 3-axis movement allows for easy changeover between different sheet layouts (e.g., 3x7, 3x8) and supports non-stop production.

• Independent Parameter Control: Placement parameters (force, height, speed) for each chip can be adjusted individually, providing fine-tuned control for different chip types or substrate materials.

• Simultaneous Glue & Placement: The parallel operation of glue dispensing and chip placement eliminates waiting time, optimizing the cycle time and overall equipment effectiveness (OEE).

• Comprehensive Process Monitoring: Equipped with multiple sensors to monitor tape feed, chip presence, glue application, and placement status. The system automatically halts and triggers an alarm upon detecting any abnormality, preventing defects and material waste.

• User-Friendly Operation: Controlled by a stable PLC + Servo system, the machine offers intuitive setup and operation, requiring only one operator for supervision and material loading.

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Technical Specifications

Applications

This machine is essential for manufacturers producing:

• Contactless Smart Cards: Payment cards, ID cards, and access control cards.

• RFID Inlays and Tags: For logistics, inventory, and asset tracking.

• Electronic Passports and Secure Documents.

• IoT and Sensor Modules: Requiring precise placement of small ICs onto substrates.

Why Choose This Auto Patch Pick and Place Machine?

For smart card and electronics manufacturers, the speed and accuracy of chip placement directly impact production yield and product performance. This machine addresses these needs by offering a robust, automated solution that combines high speed (8,000 chips/hour) with industry-leading precision (±0.05mm). Its innovative dual-platform and simultaneous processing design ensures maximum uptime and efficiency, providing a rapid return on investment by reducing labor costs, minimizing placement errors, and accelerating time-to-market for high-volume orders.